ICHEON, South Korea: South Korea’s SK Hynix said on Thursday (May 2) its high-bandwidth memory (HBM) chips used in AI chipsets are almost sold out for 2025, after their 2024 chips were fully booked.
Chief executive officer Kwak Noh-Jung said the Nvidia supplier and the world’s second-largest memory chipmaker will begin sending samples of the latest version of HBM chips, called 12-layer HBM3E, in May and begin mass producing them in the third-quarter.
Kwak said its HBM products this year had already sold out, while 2025 HBM volumes were almost sold out amid a rapid expansion of AI technology into a wider range of on-device applications such as smartphones, PCs, and automobiles.
Last month, SK Hynix announced new investment plans – a US$3.87 billion plan to build an advanced chip packaging plant in the US state of Indiana with an HBM chip line and a 5.3 trillion won (US$3.85 billion) investment in a new DRAM chip factory at home with a focus on HBMs.
